co2 laser cutting machine ceramic substrate processing application

To the ceramic substrate is divided into separate sections, you can use laser marking machine carved (drilling) series of local (not through) high tolerance holes. About a third of these holes deep substrate to produce late ruptured fault line priority. Other techniques can also be processed passage slots on the substrate to determine the morphology and fine pattern.

Since conventional ceramic having an absorption characteristic, CO2 lasers have become the choice of laser. Pulsed CO2 laser beam energy is absorbed in the ceramic surface, resulting in local heating, melting and vaporization. Figure 2 showing a top view of an alumina 0.0045 inches crossed, indicating the use of a relatively long pulse period (about 75-300m, depending on thickness) under low energy in the Gaussian beam energy distribution in the edge, because partially melted due to the heat affected zone (HAZ).
Over the years, CO2 lasers to shift work a long time, in terms of gas and energy will consume a lot of resources, but also called for a maintenance plan. In addition, the typical pulse parameters used for this application means a sealed tube CO2 laser technology is not suitable. Overall, when after years of extensive improvements, CO2 lasers in terms of reliability and maintenance problems still located behind other technologies. During maintenance, the beam quality of these lasers is easy to change; the minimum spot size can be achieved also vulnerable to long-wave effect. Terms alone, ceramic laser beam absorption characteristics make this technology on the market segment for a long time.

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